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Ultra-Compact Fanless Edge AI Jetson Orin Nano / Orin NX System
Key Features
- 2 x Gigabit LAN
- 8 x GPIO
- CAN Bus
- -20ยฐC to +70ยฐC Operating Temp
- Serial Port
- Available Until 2032
Overview
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Specifications
System
AI Performance:
70 TOPS (DLAP-211-Orin NX 8GB).
100 TOPS (DLAP-211-Orin NX 16GB).
20 TOPS (DLAP-211-Orin Nano 4GB).
40 TOPS (DLAP-211-Orin Nano 8GB).
21 TOPS (DLAP-211-JNX).
1.33 TFLOPS (DLAP-211-JT2).
472 GFLOPS (DLAP-211-Nano).
GPU:
1024-core NVIDIA Ampere GPU with 32 Tensor Cores (DLAP-211-Orin NX 8GB / DLAP-211-Orin NX 16GB).
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores (DLAP-211-Orin Nano 4GB).
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores (DLAP-211-Orin Nano 8GB).
384-core NVIDIA Voltaโข architecture GPU with 48 Tensor Cores (DLAP-211-JNX).
256-core NVIDIA Pascalโข architecture GPU (DLAP-211-JT2).
128-core NVIDIA Maxwellโข architecture GPU (DLAP-211-Nano).
CPU:
6-core Armยฎ Cortexยฎ-A78AE v8.2 64- bit CPU 1.5MB L2 + 4MB L3 (DLAP-211-Orin NX 8GB).
8-core Armยฎ Cortexยฎ-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 (DLAP-211-Orin NX 16GB).
6-core Armยฎ Cortexยฎ-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 (DLAP-211-Orin Nano 4GB / DLAP-211-Orin Nano 8GB).
6-core NVIDIA Carmel ARMยฎ v8.2 64-bit CPU 6MB L2 + 4MB L3 (DLAP-211-JNX).
Dual-core NVIDIA Denverโข 2 64-bit CPU and quad-core Armยฎ Cortexยฎ-A57 MPCore processor (DLAP-211-JT2).
Quad-core ARMยฎ Cortexยฎ-A57 MPCore processor (DLAP-211-Nano).
Memory:
4GB (DLAP-211-Orin Nano 4GB / DLAP-211-JT2 / DLAP-211-Nano).
8GB (DLAP-211-Orin NX 8GB / DLAP-211-Orin Nano 8GB / DLAP-211-JNX).
16GB (DLAP-211-Orin NX 16GB / DLAP-211-JNX).
Storage:
128GB M.2 2242 PCIe (Gen3x4) (DLAP-211-Orin NX 8GB / DLAP-211-Orin NX 16GB / DLAP-211-Orin Nano 4GB / DLAP-211-Orin Nano 8GB).
16GB eMMC 5.1 (DLAP-211-JNX / DLAP-211-JT2 / DLAP-211-Nano).
Expansion:
1 x PCIe Mini card slot.
1 x M.2 B Key 2242 socket.
1 x SD Card slot (DLAP-211-JNX / DLAP-211-JT2 / DLAP-211-Nano).
I/O
Front I/O Interfaces:
Button:
1 x Power / 1 x Reset / 1 x Recovery.
HDMI:
1 x Lockable.
USB:
4 x USB 3.0 (Type A).
Ethernet:
2 x 10/100/1000Mbps Ethernet.
Back I/O Interfaces:
USB:
1 x USB 2.0 (OTG).
Serial Port:
1 x COM RS-232/RS-422/RS-485.
CAN Bus:
1 x 2.0b (Not avaliable on the DLAP-211-Nano).
Power
DC Input:
12V.
AC Input:
60W (45ยฐC OP Temp Max) (DLAP-211-Orin NX 8GB / DLAP-211-Orin Nano 4GB / DLAP-211-Orin Nano 8GB).
60W (55ยฐC OP Temp Max) (DLAP-211-JNX / DLAP-211-JT2 / DLAP-211-Nano).
84W (55ยฐC OP Temp Max) (DLAP-211-Orin NX 16GB).
Environmental
Operating Temperature:
-20ยฐC to 70ยฐC with 0.6m/s airflow (10W)
-20ยฐC to 60ยฐC with 0.6m/s airflow (15W)
-20ยฐC to 50ยฐC with 0.6m/s airflow (25W)
-20ยฐC to 40ยฐC with 0.6m/s airflow, at MAXN, Need to use industrial grade parts (Which Tamb spec is 85ยฐC) for mPCIE interferface parts (DLAP-211-Orin NX 8GB / DLAP-211-Orin NX 16GB / DLAP-211-Orin Nano 4GB / DLAP-211-Orin Nano 8GB).
Need to use industrial grade parts (Which Tamb spec is 85ยฐC) for mPCIE interferface parts (DLAP-211-JNX / DLAP-211-JT2 / DLAP-211-Nano).
Storage Temperature:
-40ยฐC to +85ยฐC.
Humidity:
~95% @ 40ยฐC (Non-condensing) (Optional with fanless solution) without adapter.
Vibration:
Operating 5Grms, 5-500Hz, 3 axes w/M.2 SSD.
Shock:
Operating 100G, half sine 11ms duration w/ SD, M.2 SSD.
ESD:
Contact ยฑ 4kV, Air ยฑ 8kV.
Regularity:
CE & FCC Class B (EN61000-6-4/-6-2) / CE-LVD & UL by CB /ย FCCID.
Mechanical
Dimensions (W x D x H):
148mm x 120mm x 52mm (DLAP-211-JNX / DLAP-211-JT2 / DLAP-211-Nano).
148mm x 120mm x 52mm (DLAP-211-Orin NX/Orin Nano).
148mm x 120mm x 64mm (DLAP-211-Orin NXS/Orin NanoS).
Weight:
1.7kg
Mounting:
VESA / DIN Rail (Optional).
Other Features
SMA Antenna Connector:
4.
WDT:
WDT Supported.
Operating System Support:
Linuxยฎ Ubuntu.
Documentation & Support
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